汪正平

繁體中文

汪正平（Ching Ping Wong）1947年3月生於廣東廣州，係國際著名電子工程同材料科學專家，美國國家工程院院士、中國工程院外籍院士、香港科學院創院院士同台灣中央研究院院士。汪正平喺香港完成中小學教育，之後赴美留學，喺普渡大學取得學士學位，喺賓夕法尼亞州立大學取得博士學位。博士畢業後，佢喺諾貝爾獎得主Henry Taube教授指導下從事博士後研究。汪正平嘅研究集中喺電子封裝材料同聚合物材料，佢開創性咁採用硅樹脂對柵控二極體開關機進行封裝研究，實現利用聚合物材料對GDX結構嘅密封等效封裝，顯著提高封裝可靠性。呢項塑封技術克服咗傳統陶瓷封裝重量大、成本高嘅缺點，對電子工業發展有重大貢獻。汪正平曾任美國喬治亞理工學院董事教授暨材料科學及工程學系Charles Smithgall Institute講座教授。2010年，佢獲委任為香港中文大學工程學院院長。汪正平亦係電氣和電子工程師學會（IEEE）院士。

English

Professor Ching Ping Wong (born March 1947, Guangzhou, Guangdong) is a world-renowned expert in electronic engineering and materials science. He is a member of the US National Academy of Engineering, a Foreign Associate of the Chinese Academy of Engineering, a Founding Member of the Hong Kong Academy of Sciences, and an Academician of Academia Sinica (Taiwan). Wong received his primary and secondary education in Hong Kong before studying in the US, earning a BSc from Purdue University and a PhD from Pennsylvania State University. After his doctoral studies, he held a postdoctoral fellowship under Nobel laureate Professor Henry Taube. His research focuses on electronic packaging materials and polymer materials. He pioneered the use of silicone resin for encapsulating gated diode switches, achieving equivalent hermetic sealing with polymer materials that significantly improved packaging reliability. This plastic packaging technology overcame the weight and cost disadvantages of traditional ceramic packaging. Wong was a Regents Professor and the Charles Smithgall Institute Endowed Chair at the Georgia Institute of Technology. In 2010, he was appointed Dean of Engineering at the Chinese University of Hong Kong. He is also an IEEE Fellow.